SUNIX – Solutions

Vacuum Nozzle Pressure Sensor Control Application for Semiconductor Die Bonder

A semiconductor manufacturer, who we are providing consultation on helping them to improve their production efficiency while reducing overall maintenance cost, cover a vast area of products and services in semiconductor and optoelectronics sectors to establish complementary to a comprehensive product line. In conventional operation, onsite personnel are needed to monitor the pressure status from the semiconductor die bonder. If the pressure is too strong or too weak on the die bonder’s nozzle, it will case damages to the die while picking them up which result in big losses. In this smart factory and big data era, the production and machine status and data can be recorded and transmitted in real-time to the cloud or central control for predictive maintenance analysis to increase productivity and reduce maintenance costs.

Prior to Consultation – Insufficient Communication Port in the Machine

In order to monitor the status of the semiconductor die bonder; in addition to the built-in networking ports, adding more networking cards might be needed to each of industrial computers to expand additional ports to connect to network cameras, it also needs to monitor the nozzles’ pressure at various locations. However, you might run out of PCI/PCIe slots to add additional communication boards to do the job. Besides, all the products that can help expand external probe signal transmission need complicated IP setup and without self-maintenance capability. Therefore, it is desirable to seek for a new next gen and expandable solution that can monitor and transmit nozzle pressure signal for the die bonder.

Post Consultation – DevicePort Solution
Eliminate wiring through network expansion

SUNIX DevicePort serial expansion box – expanding RS-232 serial port via Ethernet. After converting air pressure analog signal to RS-232 signal; then, transmitting the signal back to the host computer via DevicePort, allowing real-time monitoring and parameters adjustment for nozzle pressure within the die bonder. This will reduce long term wear and tear on the die bonder, and at the same time increase overall production efficiency.
DevicePort allows you to eliminate the system specification limitation on expanding add-on cards in the setup; freely expand serial ports, monitoring and manage data remotely. Obtaining the key and move towards smart manufacturing!

Benefits after the implementation

Solve customer system expansion issues

Eliminate system limitation on ports expansion, allowing users the freedom to expand serial ports as needed for their specific application

Remote monitoring of air pressure

Traditionally, personnel are needed to be present onsite to monitor air pressure of each nozzles, and make necessary adjustment constantly. If the pressure is too strong or too weak, it will cause damages to the ejector pin while picking up the die which will cause financial losses. After implementing SUNIX DevicePort solution, real-time monitoring and parameters adjustment can be made remotely, and enable automatic monitoring and operation implementation for preventive maintenance to reduce production losses.

Product stability

After over half a year testing with our DevicePort solution, SUNIX product has proven to be a big improvement over their previous solution; and shown craftmanship of stability, quality, and post sales customer services.